Applications Engineer I

Remote — Full time


The Applications Engineer I assists the Sales team with technical expertise throughout the sales process. They define equipment configurations and specifications together with customers and internal resources based on process requirements. They provide strategic guidance to the product development teams within the organization on future product development. This is a highly visible liaison role that works with Process Engineers, Sales Account Managers, Customers, and HQ through Product Management, Project Management & Process Engineering.


  • Presents company technology to prospective customers during visits, phone conversations and online meetings.
  • Seeks to understand customer requirements (process capability, performance, cost of ownership, ) as thoroughly as possible.
  • Develops equipment configurations with the customer and the sales management team.
  • Validates technical equipment performance specifications (acceptance criteria) with customers.
  • Conducts equipment and process demonstrations with process engineer.
  • Creates technical reports and authors technical papers.
  • Researches, collects, and reports information on the ability and capacity of company products and competing equipmen
  • Provides technical application support to customers (remotely and onsite), sales and service staf
  • Aids in the design and development of equipment and systems, and redesign of existing systems to fulfill the needs of customers.
  • Must be able to travel domestically and internationally overnight, as needed, up to 50% of the time. Must possess a valid passpor
  • Assumes the primary technical relationship with the custom
  • Identifies customer requirements by establishing personal rapport with potential and current clients.
  • Acts as a technical bridge between the customer and factory to help solve complex technical problems or develop competitive, high-performance working proposals for customers.


  • Individuals must have a four-year engineering degree, with a minimum of five (5) years of working experience in semiconductor processing or an advanced degree and three (3) years of working experience in semiconductor processing.
  • Significant experience with Lithography Systems, Bonding Systems, Temporary Bond & Debond technology.
  • Must be able to effectively present information to all levels within a customer organization.
  • Proficiency with JMP is required.
  • Experienced in the area of capital equipment for the semiconductor industry.
  • Preferable to have fab experience in wafer/substrate processing.
  • Preferred to have Kepner-Tregoe Problem Solving and Decision-Making training.


A meaningful compensation package will be developed for the successful candidate that includes a base salary plus performance-based bonus.


To apply, please submit your resume and cover letter, preferably in MS Word format, to Derek Bush – A fully detailed, formal specification will be sent to “top-level”, qualified candidates.

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